3D Glass Cover Panel LDI Laser Direct Image Exposure machine For
Wearable
Your solutions provider for direct imaging
Based on our in-house developed direct imaging technology combined
with an advanced and modular configureable hardware system platform
(X-Series), LIMATA laser direct imaging solutions enable PCB
manufacturers to maintain high production yields and to increase
image quality and output for standard and advanced PCB applications
at lower cost of ownership over the LDI equipment lifecycle. We are
committed to closely working and partner with our customers and
stretch ourselves in order to deliver the best LDI solution for
their PCB application and process (or to solve their problem).
Advanced Automation Line for 3D Cover Glass
This automation line is used to produce BM patterning process on 3D
glass for smart phone;
3D raw glass material input by fully equipped automatic loading
machine, followed by plasma cleaner, automatic spraying machine,
tunnel oven, DLP exposure machine, developing and washing machine,
final goods output by unloading machine;
Up to 30um resolution, over 95% of yield, thinning BM layer that
easier for assembly, higher pattern quality and lower cost of
ownership for customers;
| Specifications/model | GD-200 |
| Dimension ( mm )(can be customized) | 3850mm*1350mm*1800mm |
| weight | 3000KG |
| Maximum Power | 4KW |
| Maximum Exposure Area (can be customized) | 1500mm*600mm*200mm |
| Laser source | 375nm±10nm,405nm±10nm |
| Laser output power | 375-12w(±3%),405-5W(±3%) |
| Laser transmission method | optical fiber |
| Lens magnification | 1.95 times/3.95 times |
| Resolution | 12700dpi |
| Spot size | 40mm*7mm |
| Hardware Repeatability | ±5um |
| Photosensitive Material | Photoresist |
| Input Document Format | Gerber274x |
*Specifications subject to change without notice
About US
GIS Intelligent Inc., subsidiary corporation of GIS Tech Inc.,
focusing on advanced solution for Lithium battery fabrication and
3D cover glass patterning. GIS Tech Inc. was established by
founders from U.S in 2015, Suzhou China, developing Digital
Lighting Processing (DLP) specially for different industry
patterning solution needs, which enable MEMS/Glass /PCB/Screen
printing manufacturers to achieve the best imaging results with the
highest throughput.
We are the leader in automation solution for 3D cover glass in the
world, which was used to produce high quality BM patterning on
large curvature glass by DLP photolitho. Our DLP systems powered by
Dr. Takeda, together with GIS’s semiconductor laser diodes
technologies to achieve enhanced Depth-of-Focus for 3D topography
changes, as well as patterning uniformity.
The core team of GIS Tech come from the top 500 international
companies from the United States. Based on over 20 years experience
of semiconductor technology, automation and materials teams, we
fully understand and master the industry‘s development trend and
cutting-edge technology. Our expertise in transferring patterns on
cover glass materials at high curvature level and irregular shaped
enables customers to transform possibilities into reality,
especially for 3C smart electronics and automobile cover glass.
