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380V Three Phase Laser Direct Imaging PCB HDI FPC

Jiangsu GIS Laser Technologies Inc.,
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    Buy cheap 380V Three Phase Laser Direct Imaging PCB HDI FPC from wholesalers
     
    Buy cheap 380V Three Phase Laser Direct Imaging PCB HDI FPC from wholesalers
    • Buy cheap 380V Three Phase Laser Direct Imaging PCB HDI FPC from wholesalers

    380V Three Phase Laser Direct Imaging PCB HDI FPC

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    Brand Name : GIS
    Model Number : DPX630SM
    Certification : ISO 9001 CE
    Price : negotiable price
    Supply Ability : 30set per month
    Delivery Time : 20 work days
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    380V Three Phase Laser Direct Imaging PCB HDI FPC

    laser direct imaging (LDI) system solutions PCB Solder Mask


    PCB laser direct imaging (LDI)

    when it comes to a prototype circuit board, PCB layout is one of the most important aspects. taking into account the smallest things goes wrong, the entire board will be damaged and it will not function appropriately, so PCB layout is extremely important. The imaging process, one of the most important steps in the PCB assembly process, and it does well in creating the PCB pattern.

    For engineers, laser direct imaging ( LDI ) can make a good effect on creating an imaging pattern on laminates in a streamlined process. The laminates of a PCB are fabricated by curing with thermosetting resin under the pressure and temperature layers of cloth or paper to form an integral final piece of uniform thickness. Now PCBGOGO will explain about laser direct imaging ( LDI ) for flexible circuits.


    How does laser direct imaging ( LDI ) work?
    Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.


    Specification/modelDPX230
    ApplicationPCB,HDI,FPC (inner layer,outer layer,anti-welding)
    Resolution (mass production)30um
    Capacity30-40S@18"*24"
    Exposure Size610*710mm
    Panel thickness0.05mm-3.5mm
    Alignment ModeUV-Mark
    Alignment capabilityOuter layer±12um;Inner laye±24um
    Line width tolerance±10%
    Deviation increase and decrease modeFixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
    Laser typeLD Laser,405±5nm
    File formatGerber 274X;ODB++
    Power380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10%
    ConditionYellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
    Vibration requirements to avoid violent vibration near the equipment


    About us
    We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.

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